As computer speed increases, supply voltage goes down, and supply current goes up, designers have many design challenges for today’s, high current, and fast transient response processors. In less than two years, the peak output current has risen from ~14A to ~120A. As processor DC RMS and peak current requirements rise, the need for more phases increases. Typically 15 to 20 A must be handled per phase. Designers are required to design DC-DC converters in about the same amount of space as previous designs. DC/DC step-down voltage conversion is almost exclusively based on the synchronous buck topology. The multi-phase buck topology has inherent advantages over the single-phase buck topology and is used in applications where lower supply voltages and greater load-current are required. Multiphase converters distribute the total current across phase-shifted PWM channels, output MOSFETs, and inductors. Multiphase spread heat and lower stress on components. Multiphase also operates at higher frequencies that allow the use of miniature passives reducing PCB area and cost. Reduced input and output ripple current is also achieved by phase shifting the PWM channels. This reduces the ripple RMS current requirement on input capacitors and output voltage ripple. Ceramic capacitors can be used for output filtering thus reducing the output inductance allowing for faster transient response .
With processor demands approaching 100A at low voltages (~1V), the need for using 3, and more phases is necessary. Multiphase PCB interleaved layouts are used for PC and server applications where high output current and fast transient response is important. Interleaving multi-layer VCC and ground planes layers will minimize trace inductance. Two copper traces one inch long with a spacing of 20 mils has a total trace inductance of approximately 640 pH. Four interleaved layers have a trace inductance of approximately 210 pH. Interleaving can drastically reduce trace inductance and increase transient response performance. Not using interleaving and using a single layer will result in a trace inductance of approximately 10 nH. This approach may also be used in lower current applications where transient and thermal performance is important. Single-Phase Synchronous Buck converter has the efficiency versus switching frequency trade-off. The multi-phase interleaved buck topology can solve this problem.

The region of stability is shown in the graph above (in this case for a 






Figure 2 Li-Polymer Battery Voltage Discharging Curve